Análisis y Diseño de Componentes Pasivos de Microondas y Milimétricas en Guíaonda

Título del proyecto: Análisis y Diseño de Componentes Pasivos de Microondas y Milimétricas en Guíaonda
Entidad financiadora: CICYT (Comisión Interministerial de Ciencia y Tecnología)
Ref. TIC2000-0591-C03-01
Entidades participantes: Grupo de Aplicaciones de Microondas y Grupo de Radiación (Universidad Politécnica de Valencia), Grupo de Semiconductores y Fibras Ópticas (Universidad de Valencia), Grupo de Electromagnetismo aplicado a las Telecomunicaciones (Universidad Politécnica de Cartagena)
Duración: 28/12/2000 – 27/12/2003
Investigador responsable: Dr. Vicente E. Boria Esbert (Coordinador)
Número de investigadores participantes: 5 (Subproyecto Grupo de Aplicaciones de Microondas), 13 (Proyecto)

Abstract: New multimedia applications, such as remote working, distance medical care, electronic commerce or mobile data networks, require of access and transport mechanisms with large bandwidths and high radio frequency carriers. In this context, the new radio communication systems that will give support to such applications (i.e. wireless distribution systems, mobile broadband systems and satellite systems) are being developed in the higher microwave bands and the millimetre-wave band. The implementation of these new systems implies technological challenges when designing and manufacturing the new microwave components required (circuits and antennas). With the aim of helping the industries that manufacture such components to decrease both the development costs and the times to market, a new software tool for the efficient and accurate analysis and design of waveguide passive devices, as well as planar circuits and antennas, is proposed. This software will allow the analysis and automated design of filters, multiplexers and orthomode transducers in arbitrarily shaped waveguides, and also including dielectric objects (i.e. combline filters). It will also allow the design of electrically large planar radiating elements and arrays including mutual coupling effects and feeding networks. Furthermore, the software package will be highly modular in order to allow the analysis of very complex structures through the simple connection of the basic elements integrating each microwave device. The electrical analysis of any basic element will be performed using a single theoretical frame based on generalised matrices and integral equation techniques. Within this project, our own measuring system of passive devices and antennas in waveguide and planar technology will be updated up to 50 GHz. Such system will be used to experimentally validate the new software tool through measurements of breadboards given by supporting industries or designed and manufactured by the applicants.